0.020″ DIAMETER LEAD FREE SOLDER WIRE NO-CLEAN

Description

The clear, non-corrosive, non-conductive residue is meant to be left on the board. Residues that do remain are water soluble if you want to remove them. Clean with hot water at 60C (140F) minimum.

SPECIFICATIONS
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.020″ (0.51mm)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Flux Type: No-Clean, Water Soluble
Wire Gauge: 24 AWG, 25 SWG
Process: Lead-Free
Spool: 4 oz (113.40g)